TMM10i 2-Layer 30mil Immersion Tin PCB for Microwave Circuits
1.Introduction
Rogers TMM 10i isotropic thermoset microwave material is a ceramic thermoset polymer composite designed for high plated thru-hole reliability stripline and microstrip applications. TMM 10i microwave material has an isotropic dielectric constant (Dk). Like the other TMM series materials, TMM 10i combines many of the desirable features of ceramic and PTFE substrates, with the ease of soft substrate processing techniques.
2.Key Features
High Dielectric Constant: 9.80 ±0.245
Low Loss Performance: Dissipation factor of 0.0020 at 10GHz
Thermal Stability: Thermal coefficient of Dk of -43 ppm/°K
Dimensional Reliability: Coefficient of thermal expansion matched to copper
High Temperature Resistance: Decomposition Temperature (Td) of 425°C TGA
Consistent CTE: Coefficient of Thermal Expansion x/y/z: 19ppm/K, 19ppm/K, 20ppm/K
Effective Thermal Management: Thermal Conductivity of 0.76W/mk
Wide Availability: Thickness range from 0.0015 to 0.500 inches ±0.0015"
3.Benefits
Mechanical Stability: Mechanical properties resist creep and cold flow
Chemical Resistance: Resistant to process chemicals, reducing damage during fabrication
Simplified Processing: Material does not require sodium napthanate treatment prior to electroless plating
Wire Bonding Compatibility: Based on thermoset resin, allowing for reliable wire-bonding
Assembly Reliability: Reliable wirebonding capability
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | TMM10i |
| Layer Count | Double sided |
| Board Dimensions | 70mm × 75mm = 1PC, ±0.15mm |
| Minimum Trace/Space | 6/4 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Board Thickness | 0.8mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion tin |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper Layer 1 - 35 μm
Rogers TMM10i Core - 0.762 mm (30mil)
Copper Layer 2 - 35 μm
6.PCB Statistics:
Components: 10
Total Pads: 35
Thru Hole Pads: 19
Top SMT Pads: 16
Bottom SMT Pads: 0
Vias: 15
Nets: 2
7.Typical Applications
RF and microwave circuitry
Power amplifiers and combiners
Filters and couplers
Satellite communication systems
Global Positioning Systems Antennas
Patch Antennas
Dielectric polarizers and lenses
Chip testers
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
